Samsung’s next-generation flagship chipset, the Exynos 2700, could adopt a new packaging design, according to a recent report. The company is reportedly planning to move away from Fan-Out Wafer-Level Packaging (FOWLP) technology for the upcoming SoC.
Fan-Out Wafer-Level Packaging (FOWLP), which Samsung has used since the Exynos 2400, reportedly helped improve thermal performance. However, the technology is said to have been less profitable for the company due to its complex and costly manufacturing process.
According to the report, which cites an industry official, Samsung plans to adopt a new packaging architecture for the Exynos 2700 known as Side-by-Side (SbS). In this design, the application processor (AP) and DRAM are positioned next to each other on the substrate rather than stacked.
The company is also expected to incorporate its Heat Pass Block (HPB) technology into the Exynos 2700, which could help improve heat dissipation and overall thermal efficiency.
Samsung is expected to use the Exynos 2700 in the Galaxy S27 and Galaxy S27+, both of which are likely to launch in early 2027. It will be interesting to see how the chipset’s new packaging design will impact thermal performance and overall efficiency.
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