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Honor 700 series to deliver stronger chip performance than Honor 600

Honor 700 series can take the 5G chip performance to the next level, according to a new leak. The sub-flagship will likely launch this month with upgraded specs over the previous-generation models and mobile chipsets can be a key highlight.

Leaker DigitalChatStation reported that Honor 700 series phones will follow a dual-Snapdragon 8 chip strategy, advancing the devices’ performance. This plan could make the new sub-flagship better than its competitors in the same tier, says the tipster.

The Standard Honor 700 is expected to use a Snapdragon 8s Gen 4 processor with an octa-core architecture. Its CPU configuration includes a Prime Cortex-X4 chip clocked at 3.2GHz, three Cortex-A720 cores at 3.0GHz, two Cortex-A720 cores at 2.8GHz, and two Cortex-A720 efficiency cores at 2.0GHz. It may support Adreno 825.

Honor 700 Pro can equip the Snapdragon 8 Elite Gen 5 chip, launched last year. The 3nm chip has two custom Oryon Gen 3 prime cores at 4.6GHz and six custom Oryon Gen 3 performance cores at 3.63GHz. It further pairs with the Adreno 840 GPU.

Both chipsets claim to deliver a significant performance boost over the previous versions. In addition to the chips, the Honor 700 series will feature a larger battery (up to 9000mAh) and a periscope camera upgrade, which was missing in the Honor 600.

Source – Weibo

Some netizens commented that the Honor 700 series will actually offer major performance upgrades this time. Notably, the Honor 600 Standard and Super Edition run on the Snapdragon 7 Gen 4 mobile SoC coupled with the Adreno 722 GPU.

The Honor 600 Pro debuted with the MediaTek Dimensity 8550 Elite in China. It features an overclocked version of the Snapdragon 8 Elite chip with 4.47GHz maximum clocked speed in the global market.

As per the tipster, the upcoming Honor 700 series phones carry a strong spec combination compared to their predecessors. Hence, these devices can show robust and more seamless performance for consumers in every aspect.

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