Honor 700 series chipset details leak

Honor is expected to unveil its 700 series in China this December. Ahead of the rumored launch, a tipster has revealed the chipsets expected to power the Honor 700 and Honor 700 Pro.

Well-known tipster Digital Chat Station, who recently leaked that the Honor 700 series will support a teleconverter, has now shared more details about the upcoming phones.

According to the tipster, the base Honor 700 will be powered by the Snapdragon 8s Gen 4 chipset and feature a periscope telephoto rear camera.

The Honor 700 Pro, meanwhile, is said to be equipped with the Snapdragon 8 Gen 5 chipset.

Notably, a recent leak by the same tipster also suggested that the Pro model will get a 6.57-inch 1.5K display and a 1.72-inch rear screen for selfies. It is also said to have a 200MP primary and a 50MP periscope telephoto camera. The phone is tipped to pack a battery with a capacity of around 9,000mAh.

Source (In Chinese)

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